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Work with EPS Global to tape & reel your devices and benefit from reduced production time and cost on your assembly line, increased resilience and consistency in your supply chain with a local partner, and avoid inflated freight costs as we’re located close to you!

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Tape and Reel

Tape &
Reel

Custom Tape Manufacture

Custom
Tape

Tray to Reel, Tube to Reel, Bag to Reel

Tray, Tube,
Bulk to Reel

Polarity Testing

Polarity
Testing

Component Laser Etching

Laser
Marking

3D Coplanatary Inspecting

2D/3D Coplanatary
Inspection

Carrier tape is commonly used for presenting electronic, mechanical and electromechanical devices to pick-and-place machines for automatic placement onto PCBs (printed circuit boards) or during product assembly, as it introduces increased efficiencies on the line. Carrier tape protects the devices from physical and ESD damage during shipping and storage as the parts are sealed securely in form-fitting pockets.

EPS Global Capabilities:

• Standard Embossed Carrier Tape
• Custom Carrier Tape
• Tray to Tape
• Tube to Tape
• Bulk to Tape
• 3D Coplanatary Inspection
• Electrical test and tape out
• Laser Marking
• Barcode Label Printing
• Polarity Testing & Orientation
• Bandoliering Axial & Radial Components
• Alignment
• IC Programming
• Support for Packages down to 0101 (1mm)

Component Packaging Solutions from EPS Global

EPS Global offers component tape and reeling as a standalone service or as a complement to our IC programming services in all locations. Our automatic machines use vision-controlled device placement in the tape, checking for pin orientation, laser marking and empty pockets.

We have a large and diverse inventory of standard carrier pockets in our centers around the world, and we also design and manufacture our own carrier tape specific to your project which you can find out more about here. We can take electronic or mechanical components in any format, in tubes, on trays or in bulk packaging.

Process

Receive
parts in

Correct tape chosen for your parts

Parts Tape & Reeled using automatic handlers

Parts shipped to
your point-of-use

Should you need it, we provide many value-added services including IC programming, electrical test, component preforming, laser marking, barcode label design, bandoliering axial and radial components, kitting, component baking for exposed moisture-sensitive devices, and ESD dry packing with dessicant and humidity indicators.

Our facilities adhere to internationally-recognized quality management standards and have achieved ISO9001 in all centers, and ISO14001 and ISO27001 in select centers where necessary. We are also audited to VDA6.3 by our automotive customers.

We have 23 EPS Global service centers globally offering Tape & Reeling services, located close to your operation, and have the local delivery solution available to ensure on-time delivery to work to your manufacturing schedules.

You can read more about how we can support your manufacturing operation in our blog articles.

TAPE & REEL PACKAGING SOLUTIONS FOR LEADING SEMICONDUCTOR MANUFACTURERS

EPS Global programs and tape and reels chips from the all of the leading semiconductor manufacturers.

This list shows some of our most commonly requested electronic devices, but is not exhaustive. If you don't see what you're looking for, get in touch by clicking below.

Get in touch to discuss your packaging needs
SMD Taping and Reeling

Tape & Reel for Surface Mount Devices, Panel Mount Devices

This list highlights the most commonly requested SMD devices. If your device is not listed, please get in touch with your cavity width (A0), length (B0), depth (K0), along with the desired carrier tape width (W) and the pitch (P1) between the cavity centers, or simply send us a drawing and we’ll provide a quote.

  • BQFP
  • CBGA
  • CCGA
  • CERPACK
  • CFP
  • CGA
  • CPGA
  • CQFP
  • CQGP
  • CSOP
  • DFN
  • DSOP
  • ETQFP
  • FBGA
  • FCPGA
  • HSOP
  • HSSOP
  • HTSSOP
  • HVQFN
  • LBGA
  • LFBGA
  • LGA
  • LLP
  • LQFP
  • LTCC
  • MAP-BGA
  • MCM
  • MICRO SMDXT
  • mini-SOIC
  • MQFP
  • MSOP
  • OBGA
  • ODFN
  • OPGA
  • PAC
  • PBGA
  • PGA
  • PQFN
  • PQFP
  • PSON
  • PSOP
  • QFN
  • QFP
  • QSOP
  • SBGA
  • SOIC
  • SOJ
  • SON
  • SOP
  • SSOP
  • TBGA
  • TEPBGA
  • TFBGA
  • TQFN
  • TQFP
  • TSOP
  • TSSOP
  • TVSOP
  • UCSP
  • UFBGA
  • UQFN
  • USON
  • VQFN
  • VQFP
  • VSOP
  • VSSOP
  • WQFN
  • WSON
Through-Hole Taping and Reeling

Tape & Reel for Through-Hole Components

We can tape & reel through-hole components, and we also offer preforming of bandoliered components in the in the same EPS Global Service Center (de-bandoliering, polarity testing, cropping etc). This list highlights the most commonly requested thru-hole devices. If yours is not listed, please contact us with your preforming requirements and we’ll be happy to help!

  • SIP
  • DIP
  • CDIP
  • CERDIP
  • QIP
  • SKDIP
  • SDIP
  • ZIP
  • MDIP
  • PDIP
Transisitors and Resistors Taping and Reeling

Tape & Reel for Transistors, Diodes, and MOSFETs Packages

This list highlights the most commonly requested Taping and Reeling for Transistors, Diodes, and MOSFETs Packages. If your component is not listed, please contact us indicating the component package type you require packaging.

  • TO-XX (e.g. TO-3, TO-92, TO-220, TO-247)
  • DO-XX
  • SOD
  • SOT
SMD Taping and Reeling

Tape & Reel for Electromechanical Components

In addition to electronic components, EPS Global also offers bowl-fed automated tape & reeling solutions for mechanical components of all shapes and sizes. You'll see a testimonial from Kern-Liebers below.

  • Metal Heatsinks
  • Relays
  • Connectors
  • Clips & Fixings

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Reduce Production Time by Utilizing Tape and Reel

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Minimizing production time and costs offers a competitive advantage in the mass production of products. Tape and reeling your electronic or mechanical parts can help you transition from manual to automatic placement during the assembly or surface mount technology (SMT) process, achieving faster throughput and saving you significant labor costs.

What is Component Baking?

What is
Component Baking?

All integrated circuits (ICs) are subject to moisture ingress if left in an ambient environment. You may wonder why this is an issue… how bad can it be if a component takes on a little moisture and how could this affect the functionality of the device? In fact, before we even consider the effect on how an exposed device functions inside a finished product...


EPS offer Programming as a Service

In EPS we offer Programming-as-a-Service

What does this mean? It means we take our genuinely global network and provide volume, quality Programming-as-a-Service on any device anywhere in the world. If it sounds simple, it’s not. We have 20 years invested in growing our network and our quality system from the ground up in 12 countries around the world.

Get in Touch

We are always looking to expand our partnerships and service offering. If you would like us to research and quote on any project, please contact us.

 

Contact EPS

Email programming@epsglobal.com or,
Complete the form below and a local Programming Manager will get back to you immediately.